Thermoelectric thermal stabilizer for circulating fluid RRC-600-TE-LL liquid-to-liquid family

Laser technologies of microelectronics using the example of processing the most important electronics material, which remains silicon.

The advantages of laser technology become clear when new varieties are used, which involve fairly narrow “process windows” using complex nonlinear effects: the use of multiphoton absorption, filament, thermal spalling or “hidden” internal separation. These new technologies make it possible to dramatically reduce the size of defective zones, increase the quality of processing, while simultaneously reducing the width of the cut between chips (from 50–100 to 10–20 microns), which makes it possible to move to new architecture options or increase the density of chips on the wafer.

Another option for laser technology is through drilling holes in a silicon wafer (Silicon Through Via), as well as precision laser milling and the formation of complex structures. These capabilities are significant for modern 3D assembly and micromechanical device (MEMS) designs. Laser technology makes it possible to achieve high quality holes, as well as a high ratio of hole diameter to depth, has no analogues from mechanical operations and in many cases is an interesting alternative to plasma-chemical etching.

The high stability of the laser beam directly depends on the precise thermal stabilization of the light source.

A new thermoelectric thermal stabilizer for circulating fluid RRC-600-TE-LL is developed and manufactured by Crystal Ltd. company for the fast-growing market of micro processing equipment, in particular for tasks in the micro- and electronics industry.

The advanced solutions implemented in this device allow:

• cool the circulating liquid, maximum cooling capacity 600W,
• heat the circulating liquid, maximum cooling capacity 1000W,
• stabilize the temperature of the circulating fluid with an accuracy of +/-0.02⁰С in the range from +5⁰С to +60⁰С,
• noise level 42 dB,
• control and monitor from a PC via the RS-485 interface or USB port using the Modbus-RTU protocol,
• carry out adjustment using a built-in temperature sensor or a sensor located directly at the cooled unit,
• automatically calculate setpoint offsets based on the temperature difference measured by the internal sensor and the external sensor,
• place the chiller in a 19” rack in laboratories and clean rooms,
• emergency stop in the following cases: the coolant temperature goes out of the specified range, the temperature sensor breaks, the coolant level in the tank drops below the minimum permissible, or there is no flow.