Terms and Definitions. Thermoelectric Modules

Thermoelectric Modules, (TEMs), also called as Peltier Modules or Thermoelectric Coolers, (TECs), are semiconductor-based a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current. The Peltier effect consists in releasing or absorbing of heat at the junction of two different conductors when DC flows through the junction. Vice versa, the Seebeck effect at the same modules allows converting thermal energy into electricity. Thermoelectric module, used for generating of electricity, usually called Thermoelectric Generator (TEG).

S, SN, R, C, CH, D, DH, H – TYPICAL PRODUCT SERIES AVAILABLE

“S” - SERIES, “STANDARD”

High performance thermoelectric modules for traditional cooling applications (refrigeration, electronics, industrial, automotive)

•• Maximum temperature for short time (to mount a module into unit): 130°С

•• Recommended operation temperature: up to 120°С

•• Max ΔT up to 75°С (at Thot=25°С)

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Recommended operation current: 0.7 of Imax

•• Recommended operation voltage: 0.8 of Umax

•• Wires: UL-1569 in PVC insulation

“R” - SERIES, “RELIANCE”

High performance for traditional cooling applications (refrigeration, electronics, industrial, automotive)

•• Maximum temperature for short time (to mount a module into unit): 120°С

•• Recommended operating temperature: up to 90°С

•• Max ΔT: up to 75°С (at Thot= 25°С)

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Minimal cycling stability in 20/80°С power cycling mode: over 25 000 cycles

•• Recommended operation current: 0.7 of Imax

•• Recommended operation voltage: 0.8 of Umax

•• Wires: UL-1569 in PVC insulation

“C” - SERIES, “CYCLE”

Thermoelectric modules, designed for applications that imply long-term cycling stability with the change of polarity of electric current (lasers, thermal stabilization device test stands chip production, etc.).

•• Maximum temperature for short time (to mount a module into unit): 130°С

•• Recommended operating temperature: up to 120°С

•• Recommended operation current: 0.7 of Imax.

•• Max ΔT: up to 75K (at Thot= 25°С)

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Minimal cycling stability in 20/80°С power cycling mode: up to 25 000 cycles

“H” – SERIES, “HOT”

Thermoelectric modules, designed for applications requiring high efficiency unit at operating temperature, not exceeding 150°C. Possible to use in the long-term heating mode.

•• Maximum temperature for short time (to mount a module into unit): 200°С

•• Recommended operation temperature: up to 150°С

•• Max ΔT up to 75K (at Thot=25°С)

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Modules of this series pass additional annealing at 150°С

•• Recommended operation current: 0.7 of Imax

“D” - SERIES, HIGH POWER DENSITY MODULES (“HPDM”)

Modules, designed for applications requiring high performance modules where the devices (lasers, thermal stabilization of test bench device for chip production, etc.) produce a large amount of heat that needs to be removed constantly or in a short time.

•• Maximum temperature for short time (to mount a module into unit): 130°С

•• Recommended operating temperature: up to 120°С

•• Recommended operation current: 0.5 – 0.7 of Imax.

•• Minimal cycling stability in ON-OFF power mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Minimal cycling stability in 20/80°С power cycling mode: up to 25 000 cycles

•• Recommended operating temperature not higher than 90°С

•• At operating current (I) close to 0,5 from Imax these modules provide COP, close to 1.

“SN” - SERIES, “STANDARD - 232”

High performance thermoelectric modules for traditional cooling applications (refrigeration, electronics, industrial, automotive)

•• Maximum temperature to mount a module into unit: 180°С

•• Recommended operation temperature: up to 120°С

•• Max ΔT up to 75°С (at Thot =25°С)

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Recommended operation current: 0.7 of Imax

•• Recommended operation voltage: 0.8 of Umax

•• Series is assembled on solder with melting point 232°С

“CH” - SERIES, “CYCLE + HOT”

Modules, designed for applications that imply long-term cycling stability with the change of polarity of electric current. (lasers, thermal stabilization of test bench device for chip production, etc.).

•• Maximum temperature to mount a module into unit: 200°С

•• Recommended operating temperature: up to 150°С

•• Recommended operation current: 0.7 of Imax.

•• Max ΔT: up to 75K (at Thot= 25°С)

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Minimal cycling stability in 20/80°С power cycling mode: up to 25 000 cycles

“DH” - SERIES, HIGH POWER DENSITY MODULES, “HPDM + HOT"

Thermoelectric modules, designed for applications requiring high performance modules where the devices (lasers, thermal stabilization of test bench device for chip production, etc.) produce a large amount of heat per square.

•• Maximum temperature for short time (to mount a module into unit): 200°С

•• Maximum operation temperature: 150°С

•• Recommended operation current: 0.5 – 0.7 of Imax.

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Minimal cycling stability in 20/80°С power cycling mode: over 25 000 cycles

OPTIONS FOR SURFACES FINISH:

L1 – height tolerance ± 0.01mm

L2 – height tolerance ± 0.02mm

R – round shape of the module

H – module has a circular hole in the ceramics

Mch – both sides have metallization (height tolerance ±0.15)

Mc – only cold side has metallization (height tolerance ±0.15)

Mh – only hot side has metallization (height tolerance ±0.15)

TchX – both sides have tinning, height tolerance before tinning ±0.15

TcX – only cold side has tinning, height tolerance before tinning ±0.15

ThX – only hot side has tinning, height tolerance before tinning ±0.15

X – type of solder used for tinning: 1 – solder with melting temperature 117°С ,

2 – solder with melting temperature 138°С.

No code – module is not lapped, without metallization or tinning

SEALING TYPE

S – silicon sealing;

E – epoxy sealing;

Absence of sealing index means modules without sealing.

NOTE! MAX ΔT IS REDUCED BY 2-3°С FOR SILICONE AND BY 1-2°С FOR EPOXY SEALING VERSIONS.

THE MODULES CAN BE ASSEMBLED IN KITS WITH SERIES OR PARALLEL CONNECTION OR INSTALLED IN A DEVICE FOLLOWING CUSTOMER’S DESIGN & CONSTRUCTION DOCUMENTATION